Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization
نویسندگان
چکیده
منابع مشابه
The Limited Reliability of Board-Level SAC Solder Joints under both Mechanical and Thermo-mechanical Loads
The trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for portable electronic products. In particular, board-level solder joint reliability, in term of both mechanical (e.g., drop impact) and thermo-mechanical (e.g., thermal cycling) loads is of great concern for portable electronic products. The transition to lead-free solder ...
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ژورنال
عنوان ژورنال: Materials
سال: 2020
ISSN: 1996-1944
DOI: 10.3390/ma13081862